SHEET 02 OF 06 — SERVICES
REV 2026-09-21
Engineering services.
Comprehensive electronics engineering from initial system architecture through production-ready documentation.
01SERVICES — LAYER STACK
L1 / 07
Schematic Design
From system architecture to verified netlists
A robust electronic design begins with a disciplined schematic framework. We establish system-level block diagrams, select optimal components, and configure power trees. Each schematic is built with manufacturing feasibility, thermal performance, and component lifecycle protection in mind.
We manage complete schematic capture, define netlists, write layout constraints, and configure hierarchical designs. Every component choice is backed by rigorous calculations and library validation to avoid footprints mismatch at layout time.
Deliverables
L2 / 07
PCB Layout
High-density routing for demanding applications
Our layout process transforms logic into high-performance physical circuitry. We design stackups for multi-layer boards, configure impedance-controlled routes, and plan high-density interconnect (HDI) structures. We handle blind/buried vias, microvias, and complex micro-BGA packages.
We maintain strict spacing, route critical signals as differential pairs, isolate noise-sensitive analog paths, and partition digital domains. Precision ground planes and copper pours ensure low-impedance current paths and minimize signal return loops.
Deliverables
L3 / 07
Simulation & Review
Signal integrity, power integrity, thermal analysis
We reveal physical issues before committing to hardware prototypes. Our simulation pipeline runs pre-layout analysis to set routing guidelines and post-layout verification to prove compliance. We analyze transmission lines, cross-talk, signal return paths, and bounce characteristics.
Power integrity simulations verify power distribution network (PDN) impedance, ensuring noise-free power delivery to high-speed processors. Thermal analysis maps temperature distribution, detecting hot components and verifying heatsinks or thermal vias.
Deliverables
L4 / 07
Embedded Hardware
Custom hardware platforms for embedded systems
We design complete embedded computer systems, combining high-speed processors with peripheral components. We support microcontroller architectures, modern ARM processors, and embedded Linux system-on-modules (SoMs). We handle high-speed buses like DDR memory interfaces, eMMC, and flash storage.
We integrate communications interfaces, including Gigabit Ethernet, USB, PCIe, and MIPI displays or cameras. Sensor integration and low-power IoT circuits are designed for optimal power consumption and signal quality.
Deliverables
L5 / 07
3D & Mechanical Integration
Enclosure-aware PCB design
Electronics do not exist in isolation. We ensure our layouts fit their target enclosures perfectly. We import mechanical models, place connectors, mounting holes, and high-profile components to clear mechanical boundaries. We verify clearance, thermal ventilation paths, and connectors access.
We output detailed 3D STEP models of the populated board, allowing mechanical engineering teams to run clearance checks and enclosure tests in parallel. This prevents board spins due to physical enclosure clashes.
Deliverables
L6 / 07
Consulting & Design Review
Independent design audit and advisory
We provide thorough independent reviews of existing designs to identify issues before manufacturing. We check footprints, trace widths, grounding strategies, and critical return paths. We evaluate component availability and suggest alternative components to reduce supply-chain risks.
Our reviews help you improve signal integrity, pass EMC tests, and increase manufacturing yields. We deliver clear, actionable reports prioritizing critical layout improvements and design fixes.
Deliverables
L7 / 07
Manufacturing Preparation
Production-ready documentation
We prepare comprehensive manufacturing and assembly documentation packages. We configure pick-and-place files, coordinate lists, and assembly drawings. We optimize bill-of-materials (BOM) files, standardizing footprints and verifying supplier availability.
We interface directly with PCB fabricators and assembly houses to resolve design inquiries. We help configure panelization, stencil requirements, and testpoint strategies to ensure smooth automated assembly.
Deliverables
02NEXT STEP — INQUIRY
Ready to discuss your next electronics project?
Send your requirements — schematics, constraints, or a rough idea. You'll get an initial technical assessment and a proposed approach.