SHEET 03 OF 06 — CAPABILITIES
REV 2026-09-21
TECHNICAL CAPABILITIES.
Deep engineering expertise across the full spectrum of PCB design and electronics development.
Typical stackup
01CAPABILITIES — STACKUP
Cross-section of a typical four-layer stackup, from the top surface down: top silkscreen, l1 copper, prepreg, l2 copper, core, l3 copper, prepreg, l4 copper, bottom silkscreen.
Capability schedule
02CAPABILITIES — SCHEDULE
| NO. | CAPABILITY | SCOPE |
|---|---|---|
| C01 | Multilayer PCB Design | Stackups up to 16+ signal/plane layers · Blind, buried, and microvia design · High-density interconnects (HDI) · Controlled impedance routing rules |
| C02 | Mixed-Signal Systems | Analog and digital signal isolation · Precision grounding plane splits · Guard traces and shielding rules · Low-noise analog design practices |
| C03 | Power Electronics | High-current copper pour planning · High-efficiency DC-DC convertors · Thermal analysis & heatsink vias · Power distribution network (PDN) tuning |
| C04 | Embedded Linux Hardware | ARM Cortex-A series processor design · DDR3 / DDR4 RAM length matching · eMMC, SD card, SPI flash interfaces · Gigabit Ethernet PHY routing |
| C05 | Camera Interfaces | MIPI CSI-2 high-speed routing · MIPI DSI display interfaces · Differential pair length matching · Ultra-low-jitter clock layouts |
| C06 | RF / LoRa Boards | Antenna feedline impedance tuning · PI matching network design · Shielding cans configuration · Sub-GHz & 2.4GHz RF layouts |
| C07 | Motor Control | H-bridge MOSFET power stages · Gate driver circuitry layouts · Phase current shunt sensing · EMI/EMC input filter networks |
| C08 | Industrial Control | Rugged, PLC-replacement layouts · Galvanic & optocoupler isolation · DIN-rail standard compliance · Transient voltage protection |
| C09 | High-Current PCB Design | Heavy copper layouts (2-6 oz) · Bus bars & copper pour arrays · Thermal relief pad optimization · High-current terminal selection |
| C10 | Design for Manufacturing | DFM & DFA guideline checks · Automated assembly panelization · ICT & functional testpoints layout · BOM alternate availability reviews |
| C11 | Documentation & Handoff | Gerber / NC Drill packages · Pick & place assembly sheets · 3D structural mechanical STEPs · Assembly drawings & specs |
| C12 | 3D Modelling | Accurate 3D board & component models · STEP export for enclosure integration · Mechanical fit & clearance verification · Photorealistic product renders |
03NEXT STEP — INQUIRY
Ready to discuss your next electronics project?
Send your requirements — schematics, constraints, or a rough idea. You'll get an initial technical assessment and a proposed approach.